Search results

Stakeholders are typically described as those who may affect or be affected by the actions of a firm. The purpose of this chapter is to present an argument that stakeholder theory should pay specific regard to what I term marginal stakeholders, that is, parties affected by a firm’s actions but who nevertheless have no actual or foreseeable influence to shape its strategic goals. Several key proponents of stakeholder theory maintain that these groups are not legitimate stakeholders and therefore do not warrant consideration. For example, marginal groups are routinely excluded from discussions of stakeholder fairness. Alternatively, theorists presume that advocates with leverage will protect these groups, or appeals to human rights will be sufficient. In contrast, I contend that there are cases where the firm has benefitted, but identifiable and discrete stakeholders have been negatively affected by corporate action in an environment where rights are ignored or there is no significant legal recourse. Drawing on foundational literature on fairness and insights from social psychology, I conclude that fully realized stakeholder theory means that a corporation has to consider its duties to all those affected by the impact of a firm, including the powerless.

The purpose of this paper is to describe two new thick film paste systems (one glass‐based and the other polymer‐based) for insulating aluminium substrates and allowing components like high‐intensity light‐emitting diodes to be attached to a conductor deposited on the dielectric.

Comparative measurements of the thermal resistance of different substrates mounted with metal‐oxide semiconductor field‐effect transistors were made.

The thermal advantages of these two technologies have been proved.

This paper presents useful comparative data from a replicated application using different combinations of substrates. The paper shows how the superior properties of the two new systems have been proven by thermal resistance measurements. From a thermal point of view, it is only the expensive 4 W m⁻¹ K⁻¹ insulated metal substrate that competes with the “low cost” systems.

Purpose – Electric vehicles are very topical in developed countries. The breakthrough of new battery technologies and changing conditions driven by climate policy and growing fossil fuel prices has caused all major car manufacturing countries in the developed world to initiate R&D programmes to gain competitive advantage and to foster market diffusion of electric vehicles (EVs). This chapter looks at developments in China and compares them with observations from developed countries to draw conclusions about differences in their future paths of development.

Methodology – This chapter escribes the potentials and R&D approaches for different types of EVs in developing countries, using China as example, in comparison with developed countries. It looks at innovation strategies, policy framework and potential diffusion of EVs.

Findings – Market diffusion strategies in developed countries and China may differ, since, in the former manufacturers try to implement a premium strategy (i.e. offer high-price sophisticated EVs), while in the latter market, diffusion will probably appear at the lower end of vehicle types, i.e. via electric scooters and small urban vehicles. It is concluded that the market introduction strategies of EVs in developing countries and developed countries could converge because signs of downsizing of vehicles can be observed in the developed world, while upscaling from bikes and electric scooters can be expected for China, so that large-scale market introduction could occur via small city cars.

Implications for China – Instead of following the Western motorisation path, an option for China could be to develop a new one-stop-shop mobility concept integrating small EVs into such a concept.

To consider the various aspects of this emerging market and to query the traditional view of thick film deposition and processing for successful flexible electronic production.

The current status of flexible electronics is reviewed with particular emphasis on emerging rather than established technologies. New techniques and applications are also discussed. Material and processing developments are also required to meet the new challenges and current developments and future needs are discussed.

Mass production of flexible electronic circuits using processing techniques that are more akin to the newspaper printing industry is under way. Much development of both materials and processing is required but needs in the radio frequency identification, renewable energy and display markets among others justify the investment.

Due to the wide range of new applications there is a lack of detail in this review that will necessitate further reading.

There will need to be a change of thinking in the processing and material choice used in mass production of flexible electronics by any large volume manufacturer of traditional circuits on rigid substrates. Existing, new materials need development for electrical characteristics and ease of use. New materials will undoubtedly be required.

This paper raises awareness and technical issues surrounding emerging technologies.

The momentum theory of the wind turbine, as usually stated, does not allow interference factors greater than one‐half, although experiment shows that values approaching unity are possible. The theory is extended to remove this contradiction, and the assumptions are at the same time slightly generalized.

This chapter focuses on strategies to initiate a shift in mobility behaviour away from private cars towards a combination of more environmentally friendly transport modes including public transport, ride- and car sharing or even completely carbon-free modes like walking and cycling. The requirement for such a shift is that people must be able to actually choose between different travelling options and combine them within an intermodal mobility network. Here, shared mobility has a considerable potential to fill the gap between public and individual transport options.

This chapter summarises results from different studies on shared mobility from the providers’, the users’ and the political perspective. The user’s perspective is based on an empirical study comparing car sharers’, car drivers’ and public transport users’ attitudes and mobility patterns.

The empirical findings from the case study have shown that shuttle trips by car in general, and to the train station in particular, are an important field of action for improving the environmental impact of intermodal trips. The study has also shown that car sharing enables people to live without a private car by using different transport modes for different purposes. As the majority of car sharers report needing a car only one to three times a month, they have a very small carbon footprint compared to the average car owner.

Mobility patterns are determined by local transport options as well as by personal routines. Hence, current changes due to new shared mobility options seem to have a considerable direct impact on how people organise their daily lives on the one hand and an indirect impact on their living costs on the other hand, since private cars have an important share of private household costs.

From an environmental perspective, any incentives to encourage people to choose alternative forms of transport over their private cars would seem to be particularly effective. Thus, understanding the behaviour and needs of multi- and intermodal travellers is an important step towards sustainable mobility. Acknowledging that most travellers still need a car every now and then, car sharing is an essential addition to public transport systems, supporting both public transport use and carbon-free mobility like walking and cycling.

The purpose of this paper is to review recent advances in wire bonding of low‐k devices.

Dozens of journal and conference articles published in 2005‐2008 are reviewed.

The paper finds that many articles have discussed and analysed problems/challenges such as bond pad metal peeling/lift, non‐sticking on pad, decreased bonding strength and lower wire‐bond assembly yield. The paper discusses the articles' solutions to the problems and recent findings/developments in wire bonding of low‐k devices.

Because of the page limitation, only brief discussions are given in this paper. Further reading is needed for more details.

The paper attempts to provide an introduction to recent developments and the trends in wire bonding of low‐k devices. With the references provided, readers may explore more deeply by reading the original articles.

This paper attempts to review recent advances in wire bonding using copper wire.

Dozens of journal and conference articles published recently are reviewed.

The problems/challenges such as wire open and short tail defects, poor bondability for stitch/wedge bonds, oxidation of Cu wire, strain‐hardening effects, and stiff wire on weak support structures are briefly analysed. The solutions to the problems and recent findings/developments in wire bonding using copper wire are discussed.

Because of page limitation of the paper, only a brief review is conducted. Further reading is needed for more details.

This paper attempts to provide introduction to recent developments and the trends in wire bonding using copper wire. With the references provided, readers may explore more deeply by reading the original articles.

This paper attempts to review recent advances in wire bonding using insulated wire and new challenges in wire bonding for advanced microelectronics packaging.

Dozens of journal articles, conference articles and patents published or issued in 2004‐2007 are reviewed.

The advantages and problems/challenges related to wire bonding using insulated wire are briefly analysed, and several solutions to the problems and recent findings/developments related to wire bonding using insulated wire are discussed.

Because of page limitation of the paper, only brief review is conducted. Further reading is needed for more details.

This paper attempts to provide introduction to recent developments and the trends in wire bonding using insulated wire. With the references provided, readers may explore more deeply by reading the original articles and patent documents.